The "S-MODULE" range of continuous selective plating equipment, with one or two strands, combines flexibility and reliability for optimum high-quality production. This equipment has been designed to meet the surface treatment requirements of today's connector and semiconductor manufacturers. Thanks to its modular design, changing parts or plating technology can be done quickly and easily.

Within the versatile processing cell system, a wide range of accessories and interchangeable plating heads are available, including global plating, high-speed plating, partial immersion, side wave cascade, brush plating and many other custom-designed plating heads.

Spot and strip plating units can also be supplied as stand-alone modules that are easily interchangeable and adaptable to most plating equipment on the market.

Spotter VT

The SPOTTER-VT enables the metallisation of flat semiconductor frames or formed contact terminals with options such as dot or stripe metallisation on one or both sides simultaneously, precise and exclusive East/West metallisation of contact edges or North/South metallisation by inserting silicone masking shapes between contact terminals. (more information)

Spotter HS

On the HSW version, a newly developed drive system means that very wide and fragile leadframes up to 160 mm wide can be easily tacked without deformation thanks to the tensile force. The SPOTTER-HSW's new drive system consists of two titanium conveyor belts with rubber grips under the masking link chain. The transport belts and the rear rubber masking belt are driven simultaneously at the same speed, resulting in greater stitch accuracy - no friction force - and higher stitch sealing pressure. (More information)

Masking Chain

Developed for the SPOTTER range of equipment, EESA presents the high-precision masking tool for high-speed, continuous-motion plating on flat or 3D-formed connector strips or semiconductor frames. (more information)

Rainbow Cell

The RAINBOW-CELL is specially designed to handle thick strips with a large radius of curvature that cannot be loaded around the guide rollers of a conventional wheel-type plating unit (more information).

Combi Cell

The *COMBI-CELL* is a flexible metallization unit for the production of various types of connector terminals, which require high metallization selectivity and fast tool changeover times. (more information)

Spotter CS

EESA presents the SPOTTER-CS, the latest selective *spot* plating cell for continuous motion plating on cut strip leadframes or bulk components. The SPOTTER-CS is used in the 'LPP 1/U' range of plating equipment. (more information)